Qiao, Zheng; Chen, Shuwen; Fan, Shicheng; Xiong, Ze; Lim, Chwee Teck Epidermal Bioelectronics for Management of Chronic Diseases: Materials, Devices and Systems ADVANCED SENSOR RESEARCH, 2 (8), 2023, DOI: 10.1002/adsr.202200068. Abstract | BibTeX | Endnote @article{ISI:001283944600005,
title = {Epidermal Bioelectronics for Management of Chronic Diseases: Materials, Devices and Systems},
author = {Zheng Qiao and Shuwen Chen and Shicheng Fan and Ze Xiong and Chwee Teck Lim},
doi = {10.1002/adsr.202200068},
times_cited = {2},
issn = {2751-1219},
year = {2023},
date = {2023-08-01},
journal = {ADVANCED SENSOR RESEARCH},
volume = {2},
number = {8},
publisher = {WILEY},
address = {111 RIVER ST, HOBOKEN 07030-5774, NJ USA},
abstract = {Chronic diseases are currently posing a major challenge not only to our life expectancy and healthspan but also to the healthcare system, as patients will need continual monitoring, treatment, and care to mitigate some of the severe health complications that may arise. Merely frequent visits to medical facilities and clinics may not be sufficient. Home-based point-of-care diagnosis and monitoring may be needed for the prevention and/or management of long-term complications. Recent advances in materials, fabrication methods, and bioelectronics have led to some epidermal systems that can measure critical physiological parameters and provide long-term monitoring of several chronic diseases. In this review, it is systematically outlined the progress of epidermal bioelectronics aimed at managing common chronic diseases, such as cardiovascular diseases, diabetes, and chronic wounds. Flexible and stretchable materials with related engineering approaches that render wearability are also discussed. Finally, a list of current challenges, future perspectives as well as potential research directions with the aim towards better translation in bringing these wearable technologies from the laboratory to the clinic and market are presented.},
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Chronic diseases are currently posing a major challenge not only to our life expectancy and healthspan but also to the healthcare system, as patients will need continual monitoring, treatment, and care to mitigate some of the severe health complications that may arise. Merely frequent visits to medical facilities and clinics may not be sufficient. Home-based point-of-care diagnosis and monitoring may be needed for the prevention and/or management of long-term complications. Recent advances in materials, fabrication methods, and bioelectronics have led to some epidermal systems that can measure critical physiological parameters and provide long-term monitoring of several chronic diseases. In this review, it is systematically outlined the progress of epidermal bioelectronics aimed at managing common chronic diseases, such as cardiovascular diseases, diabetes, and chronic wounds. Flexible and stretchable materials with related engineering approaches that render wearability are also discussed. Finally, a list of current challenges, future perspectives as well as potential research directions with the aim towards better translation in bringing these wearable technologies from the laboratory to the clinic and market are presented. - FNClarivate Analytics Web of Science
- VR1.0
- PTJ
- AUQiao, Z
Chen, SW
Fan, SC
Xiong, Z
Lim, CT
- AFZheng Qiao
Shuwen Chen
Shicheng Fan
Ze Xiong
Chwee Teck Lim
- TIEpidermal Bioelectronics for Management of Chronic Diseases: Materials, Devices and Systems
- SOADVANCED SENSOR RESEARCH
- LAEnglish
- DTArticle
- DEChronic Disease Management; Epidermal Bioelectronics; Flexible Wearable Sensors
- IDPRINTABLE ELASTIC CONDUCTORS; CARBON NANOTUBES; PRESSURE SENSORS; ELECTROCHEMICAL DETECTION; CARDIOVASCULAR-DISEASE; ENVIRONMENTAL-FACTORS; MOUTHGUARD BIOSENSOR; POLYURETHANE SPONGE; HIGH-CONDUCTIVITY; TENSILE STRAIN
- ABChronic diseases are currently posing a major challenge not only to our life expectancy and healthspan but also to the healthcare system, as patients will need continual monitoring, treatment, and care to mitigate some of the severe health complications that may arise. Merely frequent visits to medical facilities and clinics may not be sufficient. Home-based point-of-care diagnosis and monitoring may be needed for the prevention and/or management of long-term complications. Recent advances in materials, fabrication methods, and bioelectronics have led to some epidermal systems that can measure critical physiological parameters and provide long-term monitoring of several chronic diseases. In this review, it is systematically outlined the progress of epidermal bioelectronics aimed at managing common chronic diseases, such as cardiovascular diseases, diabetes, and chronic wounds. Flexible and stretchable materials with related engineering approaches that render wearability are also discussed. Finally, a list of current challenges, future perspectives as well as potential research directions with the aim towards better translation in bringing these wearable technologies from the laboratory to the clinic and market are presented.
- C3National University of Singapore; National University of Singapore; National University of Singapore; National University of Singapore; Institute for Functional Intelligent Materials (I-FIM); National University of Singapore
- RPLim, CT (corresponding author), Natl Univ Singapore, Dept Biomed Engn, Singapore 117583, Singapore; Lim, CT (corresponding author), Natl Univ Singapore, SIA NUS Digital Aviat Corp Lab, Singapore 117602, Singapore; Lim, CT (corresponding author), Natl Univ Singapore, Inst Hlth Innovat & Technol iHealthtech, Singapore 117599, Singapore; Lim, CT (corresponding author), Natl Univ Singapore, Mechanobiol Inst, Singapore 117411, Singapore; Lim, CT (corresponding author), Natl Univ Singapore, Inst Funct Intelligent Mat, Singapore 117544, Singapore
- FXZ.Q. and S.W.C. contributed equally to this work. The authors gratefully acknowledged support from the MechanoBioEngineering Laboratory at the Department of Biomedical Engineering, Advanced Research and Technology Innovation Centre (ARTIC), Mechanobiology Institute (MBI), Institute for Functional Intelligent Materials (I-FIM) and the Institute for Health Innovation and Technology (iHealthtech) at the National University of Singapore. Support provided by the National Research Foundation, Singapore and A*STAR under its RIE2020 Industry Alignment Fund - Industry Collaboration Projects (IAF-ICP) grant call (Grant No. I2001E0059) - SIA-NUS Digital Aviation Corporate Lab and the HBMS Domain Industry Alignment Fund Pre-Positioning Grant (Grant No. H17/01/017).
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Chen, Shuwen; Fan, Shicheng; Qi, Jiaming; Xiong, Ze; Qiao, Zheng; Wu, Zixiong; Yeo, Joo Chuan; Lim, Chwee Teck Ultrahigh Strain-Insensitive Integrated Hybrid Electronics Using Highly Stretchable Bilayer Liquid Metal Based Conductor 30 ADVANCED MATERIALS, 35 (5), 2022, DOI: 10.1002/adma.202208569. Abstract | BibTeX | Endnote @article{ISI:000898819000001,
title = {Ultrahigh Strain-Insensitive Integrated Hybrid Electronics Using Highly Stretchable Bilayer Liquid Metal Based Conductor},
author = {Shuwen Chen and Shicheng Fan and Jiaming Qi and Ze Xiong and Zheng Qiao and Zixiong Wu and Joo Chuan Yeo and Chwee Teck Lim},
doi = {10.1002/adma.202208569},
times_cited = {30},
issn = {0935-9648},
year = {2022},
date = {2022-12-15},
journal = {ADVANCED MATERIALS},
volume = {35},
number = {5},
publisher = {WILEY-V C H VERLAG GMBH},
address = {POSTFACH 101161, 69451 WEINHEIM, GERMANY},
abstract = {Human-interfaced electronic systems require strain-resilient circuits. However, present integrated stretchable electronics easily suffer from electrical deterioration and face challenges in forming robust multilayered soft-rigid hybrid configurations. Here, a bilayer liquid-solid conductor (b-LSC) with amphiphilic properties is introduced to reliably interface with both rigid electronics and elastomeric substrates. The top liquid metal can self-solder its interface with rigid electronics at a resistance 30% lower than the traditional tin-soldered rigid interface. The bottom polar composite comprising liquid metal particles and polymers can not only reliably interface with elastomers but also help the b-LSC heal after breakage. The b-LSC can be scalably fabricated by printing and subsequent peeling strategies, showing ultra-high strain-insensitive conductivity (maximum 22 532 S cm(-1)), extreme stretchability (2260%), and negligible resistance change under ultra-high strain (0.34 times increase under 1000% strain). It can act as stretchable vertical interconnect access for connecting multilayered layouts and can be scalably and universally fabricated on various substrates with a resolution of approximate to 200 mu m. It is demonstrated that it can construct stretchable sensor arrays, multi-layered stretchable displays, highly integrated haptic user-interactive optoelectric E-skins, visualized heaters, robot touch sensing systems, and wireless powering for wearable electronics.},
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Human-interfaced electronic systems require strain-resilient circuits. However, present integrated stretchable electronics easily suffer from electrical deterioration and face challenges in forming robust multilayered soft-rigid hybrid configurations. Here, a bilayer liquid-solid conductor (b-LSC) with amphiphilic properties is introduced to reliably interface with both rigid electronics and elastomeric substrates. The top liquid metal can self-solder its interface with rigid electronics at a resistance 30% lower than the traditional tin-soldered rigid interface. The bottom polar composite comprising liquid metal particles and polymers can not only reliably interface with elastomers but also help the b-LSC heal after breakage. The b-LSC can be scalably fabricated by printing and subsequent peeling strategies, showing ultra-high strain-insensitive conductivity (maximum 22 532 S cm(-1)), extreme stretchability (2260%), and negligible resistance change under ultra-high strain (0.34 times increase under 1000% strain). It can act as stretchable vertical interconnect access for connecting multilayered layouts and can be scalably and universally fabricated on various substrates with a resolution of approximate to 200 mu m. It is demonstrated that it can construct stretchable sensor arrays, multi-layered stretchable displays, highly integrated haptic user-interactive optoelectric E-skins, visualized heaters, robot touch sensing systems, and wireless powering for wearable electronics. - FNClarivate Analytics Web of Science
- VR1.0
- PTJ
- AUChen, SW
Fan, SC
Qi, JM
Xiong, Z
Qiao, Z
Wu, ZX
Yeo, JC
Lim, CT
- AFShuwen Chen
Shicheng Fan
Jiaming Qi
Ze Xiong
Zheng Qiao
Zixiong Wu
Joo Chuan Yeo
Chwee Teck Lim
- TIUltrahigh Strain-Insensitive Integrated Hybrid Electronics Using Highly Stretchable Bilayer Liquid Metal Based Conductor
- SOADVANCED MATERIALS
- LAEnglish
- DTArticle
- DEPrintable Electronics; Soft-rigid Integrated Electronics; Stretchable Bioelectronics; Stretchable Conductors; Wearable Electronics
- IDFABRICATION; ELASTOMER; SURFACE; FIBERS; ALLOY; FILMS; SOFT
- ABHuman-interfaced electronic systems require strain-resilient circuits. However, present integrated stretchable electronics easily suffer from electrical deterioration and face challenges in forming robust multilayered soft-rigid hybrid configurations. Here, a bilayer liquid-solid conductor (b-LSC) with amphiphilic properties is introduced to reliably interface with both rigid electronics and elastomeric substrates. The top liquid metal can self-solder its interface with rigid electronics at a resistance 30% lower than the traditional tin-soldered rigid interface. The bottom polar composite comprising liquid metal particles and polymers can not only reliably interface with elastomers but also help the b-LSC heal after breakage. The b-LSC can be scalably fabricated by printing and subsequent peeling strategies, showing ultra-high strain-insensitive conductivity (maximum 22 532 S cm(-1)), extreme stretchability (2260%), and negligible resistance change under ultra-high strain (0.34 times increase under 1000% strain). It can act as stretchable vertical interconnect access for connecting multilayered layouts and can be scalably and universally fabricated on various substrates with a resolution of approximate to 200 mu m. It is demonstrated that it can construct stretchable sensor arrays, multi-layered stretchable displays, highly integrated haptic user-interactive optoelectric E-skins, visualized heaters, robot touch sensing systems, and wireless powering for wearable electronics.
- C3National University of Singapore; National University of Singapore; National University of Singapore; Institute for Functional Intelligent Materials (I-FIM); National University of Singapore
- RPLim, CT (corresponding author), Natl Univ Singapore, Inst Hlth Innovat & Technol iHealthtech, Singapore 119276, Singapore; Lim, CT (corresponding author), Natl Univ Singapore, Dept Biomed Engn, Singapore 117583, Singapore; Lim, CT (corresponding author), Natl Univ Singapore, Mechanobiol Inst, Singapore 117411, Singapore; Lim, CT (corresponding author), Natl Univ Singapore, Inst Funct Intelligent Mat, Singapore 117544, Singapore
- FXThis work was supported by the Institute for Health Innovation and Technology (iHealthtech), Mechano BioEngineering Laboratory at the Department of Biomedical Engineering and the Institute for Functional Intelligent Materials (I-FIM) at the National University of Singapore (NUS). We also acknowledged support from the National Research Foundation and Singapore A*STAR under its RIE2020 Industry Alignment Fund - Industry Collaboration Projects (IAF-ICP) Grant (Grant No. I2001E0059) - SIA-NUS Digital Aviation Corp Lab. We also thanked Tianpeng Ding, Xiaoqiao Wang, and Ghim Wei Ho from NUS for their help with Energy Dispersive Spectroscopy analysis and Guanxiang Wan from NUS for help with Supplementary Video 6.
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|